Development, structure and properties of Cu/Mg and Al/Mg composite wires

As a result of severe plastic deformation, Cu/Mg and Al/Mg composites were obtained by means of hydrostatic extrusion at room temperature. The microstructures of these composites were investigated. The electrical and mechanical properties of the composite wires were compared with the theoretical estimations. It was revealed that, due to mechanical alloying processes under cold severe plastic deformation, different solid solutions and intermetallic compounds form at the interfaces and increase the strength of the composites. It was concluded, that a copper sleeve of the composites provides their low electrical resistivity. The obtained results can be used for the development of high-strength conductors based on Cu and Al. (C) 2020 The Authors. Published by Elsevier B.V.