Metal nano-floating gate memory devices fabricated at low temperature

被引:30
|
作者
Koliopoulou, S.
Dimitrakis, P.
Goustouridis, D.
Normand, P.
Pearson, C.
Petty, M. C.
Radamson, H.
Tsoukalas, D.
机构
[1] NCSR Demokritos, Inst Microelect, Aghia Paraskevi 15310, Greece
[2] Univ Durham, Ctr Mol & Nanoscale Elect, Durham DH1 3LE, England
[3] KTH, Royal Inst Technol, S-16440 Kista, Sweden
[4] Natl Tech Univ Athens, Dept Appl Sci, Zografos 15780, Greece
关键词
nanoparticles; SiGe; memory; wafer bonding; Langmuir-Blodgett deposition; hybrid electronics;
D O I
10.1016/j.mee.2006.01.235
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this communication, we report on the realization of low-temperature processed Electrically Erasable Programmable Read-Only Memory (EEPROM) like device with embedded gold nanoparticles. The realization is based on the fabrication of a V-groove SiGe Metal Oxide Semiconductor Field Effect Transistor (MOSFET), the functionalization of a gate oxide followed by self-assembly of gold nanoparticles and finally, the deposition of an organic insulator by Langmuir-Blodgett (LB) technique. Such structures were processed at a temperature lower than 400 degrees C. The electrical characteristics of the final hybrid Metal Insulator Semiconductor FET (MISFET) memory cells were evaluated in terms of memory window and program/erase voltage pulses. A model describing the memory characteristics, based on the electronic properties of the gate stack materials, is presented. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:1563 / 1566
页数:4
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