On Asymmetric Diffusional Solidification During Transient Liquid Phase Bonding

被引：8
|
作者：
Bigvand, A. Ghobadi [1 ]
Ojo, Olanrewaju A. [1 ]
机构：
[1] Univ Manitoba, Dept Mech & Mfg Engn, Winnipeg, MB R3T 5V6, Canada
来源：
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE | 2014年 / 45A卷 / 04期
基金：
加拿大自然科学与工程研究理事会;
关键词：
TEMPERATURE-GRADIENT; SYSTEM; ALLOY;
D O I：
10.1007/s11661-014-2208-2
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The underlying cause of asymmetric diffusion solidification which alters microstructure during transient liquid phase bonding under low temperature gradient was studied. A new solute-conserving asymmetric numerical model coupled with experimental verification showed that a transition from bi-directional to unidirectional solidification, under a constant temperature gradient, is controlled by competition between liquid and solid-state diffusion at one of the two liquid-solid interfaces. This mechanistic understanding would aid a more effective use of the process.
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页码：1670 / 1674
页数：5
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