共 17 条
- [1] Developing MEMS DC Electric Current Sensor for End-use Monitoring of DC Power Supply: Part IV - Cantilever-based Magnetic Field Sensor Device 2014 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP), 2014, : 180 - 183
- [2] Developing MEMS DC Electric Current Sensor for End-use Monitoring of DC Power Supply: Part V - Corresponding Relationship between Polarization and Output Voltage 2015 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP), 2015,
- [3] Developing MEMS DC Electric Current Sensor for End-use Monitoring of DC Power Supply: Part VI - Corresponding Relationship between Sensitivity and Magnetic Induction 2017 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP 2017), 2017,
- [4] Developing MEMS DC Electric Current Sensor for End-use Monitoring of DC Power Supply: Part II MEMS-scale Device with Five-PZT Plates 2012 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP), 2012, : 244 - 247
- [5] Developing MEMS Electric Current Sensors for End-use Monitoring of Power Supply: Part IX - Threshold-Triggered Current Sensing SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS (DTIP 2019), 2019,
- [6] Developing MEMS Electric Current Sensors for End-use Monitoring of Power Supply: Part XI - A Nonlinear Error Correction Scheme 2021 SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS, 2021,
- [7] Passive piezoelectric DC sensor applicable to one-wire or two-wire DC electric appliances for end-use monitoring of DC power supply Microsystem Technologies, 2012, 18 : 1897 - 1902
- [8] Passive piezoelectric DC sensor applicable to one-wire or two-wire DC electric appliances for end-use monitoring of DC power supply MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2012, 18 (11): : 1897 - 1902
- [9] Developing MEMS Electric Current Sensors for End-use Monitoring of Power Supply: Part XIII - Analytical Study on Thermoelastic Damping for Structural Optimization Applicable to Resonant Galvanometers 2024 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS, DTIP 2024, 2024,