Design of Safe Two-Wire Interface-Driven Chip-Scale Neurostimulator for Visual Prosthesis

被引：17

作者：

Jung, Louis H. ^{[1
]}

Shany, Nitzan ^{[1
]}

Emperle, Alexander ^{[2
]}

Lehmann, Torsten ^{[3
]}

Byrnes-Preston, Phil ^{[1
]}

Lovell, Nigel H. ^{[1
]}

Suaning, Gregg J. ^{[1
]}

机构：

[1] Univ New S Wales, Grad Sch Biomed Engn, Sydney, NSW 2052, Australia

[2] Robert Bosch GmbH, D-70049 Stuttgart, Germany

[3] Univ New S Wales, Sch Elect Engn & Telecommun, Sydney, NSW 2052, Australia

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 2013年 / 48卷 / 09期

基金：

澳大利亚研究理事会;

关键词：

Neuro-stimulator; split architecture; visual prosthesis; RETINAL PROSTHESIS; ELECTRICAL-STIMULATION; SYSTEM; NERVE; LINK;

D O I：

10.1109/JSSC.2013.2264136

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Visual prostheses with a high number of electrodes are now of great research interest driven by the successful recent clinical trials. High channel devices are confronted with numerous challenges many of which can be addressed by adopting a multi-implant architecture. However now the difficulties lie in ensuring safety of the inter-implant interface by addressing the associated risks, often neglected in the past. This paper presents a multi-implant architecture-based 98-channel neurostimulator with an inter-implant interface consisting only of two wires, carrying both power and semi-duplex data. The interface is ac-coupled both to prevent high levels of dc current in the presence of insulation failures and to maintain a charge-balanced interface. The interface is also monitored within the stimulator itself for added means of safety. The stimulator is fabricated using a 0.35-mu m HVCMOS technology and occupies 4.9 x 4.9 mm(2) without any external discrete components, making it suitable for a chip-scale packaging.

引用

页码：2217 / 2229

页数：13