High Thermal Stability of SiC Packaging with Thermosetting Imide-based Nanocomposite Encapsulating Materials Combined with Sintered Ag Paste Die-attach

被引：0

作者：

Sugioka, Takuo ^{[1
]}

Nagao, Shijo ^{[2
]}

Ogawa, Satoshi ^{[1
]}

Fujibayashi, Teruhisa ^{[1
]}

Sumida, Yasutaka ^{[1
]}

Hao, Zhang ^{[2
]}

Suganuma, Katsuaki ^{[2
]}

机构：

[1] NIPPON SHOKUBAI CO LTD, Adv Mat Res Ctr, 5-8 Nishi Otabi Cho, Suita, Osaka 5648512, Japan

[2] Osaka Univ, Inst Sci & Ind Res, 8-1 Mihogaoka, Suita, Osaka 5670047, Japan

来源：

2016 IEEE 16TH INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO) | 2016年

关键词：

D O I：

暂无

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Heat-resistance of novel encapsulating materials made from thermosetting imide/silsesquioxane nanocomposites are demonstrated in SiC-SBD packages, which are die-attached with a sintered Ag paste. The test specimens are exposed to thermal cycling between -50 degrees C and 250 degrees C and humidity resistance evaluation test at 121 degrees C, 0.19MPa, 95% Rh. The results reveal that the excellent heat and humidity-resistance is brought by the outstanding stability of the thermosetting imide-based nanocomposite encapsulating materials and its remarkable miscibility to sintered Ag die-attach.

引用

页码：184 / 187

页数：4

共 10 条

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