High-frequency measurement based characterisation of the transmission line parameters of packages and interconnection structures

被引：0
|
作者：
Sercu, S
Martens, L
机构：
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING - IEEE 5TH TOPICAL MEETING | 1996年
关键词：
D O I：
10.1109/EPEP.1996.564783
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper a technique is presented for high-frequency circuit modeling of coupled interconnection structures such as high-density connectors and large pin count electronic packages. The generated circuit model consists out of basic cells the number of which is function of the length and the bandwidth of the model. The problems associated with the modeling of a high number of coupled conductors are reduced to the modeling of two-conductor and three-conductor structures.
引用
收藏
页码：67 / 70
页数：4
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