Suppression of current collapse by hole injection from drain in a normally-off GaN-based hybrid-drain-embedded gate injection transistor

被引:104
|
作者
Tanaka, Kenichiro [1 ]
Morita, Tatsuo [1 ]
Umeda, Hidekazu [1 ]
Kaneko, Saichiro [1 ]
Kuroda, Masayuki [1 ]
Ikoshi, Ayanori [1 ]
Yamagiwa, Hiroto [1 ]
Okita, Hideyuki [1 ]
Hikita, Masahiro [1 ]
Yanagihara, Manabu [1 ]
Uemoto, Yasuhiro [1 ]
Takahashi, Satoru [1 ]
Ueno, Hiroaki [1 ]
Ishida, Hidetoshi [1 ]
Ishida, Masahiro [1 ]
Ueda, Tetsuzo [1 ]
机构
[1] Panasonic Corp, Automot & Ind Syst Co, Div Engn, Kyoto 6178520, Japan
关键词
ELECTRON-MOBILITY TRANSISTORS; FIELD-EFFECT TRANSISTORS; ALGAN/GAN HEMTS; SEMICONDUCTOR; DEGRADATION; VOLTAGE; SIMULATION;
D O I
10.1063/1.4934184
中图分类号
O59 [应用物理学];
学科分类号
摘要
Current collapse is suppressed up to 800 V of drain voltage in our proposed device, Hybrid-Drain-embedded Gate Injection Transistor (HD-GIT), where an additional p-GaN layer is grown on the AlGaN barrier layer and is connected to the drain electrode. We present, based on a device simulation and electroluminescence study, that the hole injection from the additional drain-side p-GaN at the OFF state compensates the hole emission in the epilayer. As a result, the gate-drain access region is not negatively charged at the OFF state, resulting in the drastic suppression of current collapse in HD-GIT. (C) 2015 AIP Publishing LLC.
引用
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页数:4
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