A Fully Automatic Test System for Characterizing Large-Array Fine-Pitch Micro-Bump Probe Cards

被引：0

作者：

Marinissen, Erik Jan ^{[1
]}

Fodor, Ferenc ^{[1
]}

De Wachter, Bart ^{[1
]}

Kiesewetter, Jorg ^{[2
]}

Hill, Eric ^{[3
]}

Smith, Ken ^{[3
]}

机构：

[1] IMEC VZW, Kapeldreef 75, B-3001 Leuven, Belgium

[2] Cascade Microtech GmbH, Suss Str 1, D-01561 Thiendorf, Germany

[3] FormFactor Inc, 9100 SW Gemini Dr, Beaverton, OR 97008 USA

来源：

2017 INTERNATIONAL TEST CONFERENCE IN ASIA (ITC-ASIA) | 2017年

关键词：

D O I：

暂无

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

A fully automatic test system for characterizing advanced probe cards able to probe on large-array fine-pitch micro-bumps ( such as JEDEC's Wide-I/O Mobile DRAM interfaces [1, 2]) has been specified, developed, installed, and brought to a full-operational state. The system is based on a Cascade CM300 probe station from FormFactor and National Instruments PXI test instrumentation and complemented by in-house developed software for automatic test generation and data analysis and visualization. The system is successfully used in conjunction with FormFactor's Pyramid Probe (R) RBI probe-card technology on WIO1 and WIO2 micro-bump arrays on empty set300mm wafers designed and manufactured by IMEC. This paper describes the various system components in hardware and software, and experimental results obtained with several test wafers.

引用

页码：144 / 149

页数：6

共 9 条

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