Deposition Of Materials Using A Simple Planar Coil Radio Frequency Inductively Coupled Plasma System

被引：0
|
作者：
Ng, K. H. [1 ]
Wong, C. S. [1 ]
Yap, S. L. [1 ]
Gan, S. N. [2 ]
机构：
[1] Univ Malaya, Plasma Res Lab, Dept Phys, Fac Sci, Kuala Lumpur 50603, Malaysia
[2] Univ Malaya, Fac Sci, Dept Chem, Kuala Lumpur 50603, Malaysia
来源：
FRONTIERS IN PHYSICS-BOOK | 2009年 / 1150卷
关键词：
Planar Coil Radio Frequency Inductively Coupled Plasma; Plasma enhanced chemical vapor deposition;
D O I：
暂无
中图分类号：
O4 [物理学];
学科分类号：
0702 ;
摘要：
A planar coil RF inductively coupled plasma (PC-RFICP) systems is set up for the purpose of thin film deposition. The system is powered by a 13.56 MHz, 550W, 50 Omega RF generator. The RF power is transferred to the plasma via a planar induction coil. The impedance matching unit consists of an air core step-down transformer and a tunable vacuum capacitor. This system is used for the plasma enhanced chemical vapor deposition (PECVD) of diamond-like carbon (DLC) film on silicon substrate, and hydrogenated amorphous carbon (a-C:H) film.
引用
收藏
页码：436 / +
页数：2
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