Integration of silicon circuit components onto plastic substrates using fluidic self-assembly

被引:4
|
作者
Stauth, SA [1 ]
Parviz, BA [1 ]
机构
[1] Univ Washington, Dept Elect Engn, Seattle, WA 98105 USA
关键词
D O I
10.1109/ICMENS.2005.63
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrate the use of fluidic self-assembly for the integration of microfabricated silicon components, including diffusion resistors and single crystal silicon field effect transistors, onto a clear, flexible plastic substrate. Preferential self-assembly of parts on a template is achieved with complementary shape recognition. The self-assembly process is driven in part by capillary forces resultant from a low melting point alloy re-flow. Our method allows for the integration of parts made via incompatible microfabrication processes onto a single platform. The self-assembly is performed in a single step providing both mechanical and electrical connection between substrate and silicon component.
引用
收藏
页码:147 / 152
页数:6
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