Packaging of Semiconductor Laser Bars in Tube Furnace

被引：0

作者：

Zhang Qiuyue ^{[1
]}

Jing Hongqi ^{[2
]}

Yuan Qinghe ^{[2
]}

Ma Xiaoyu ^{[2
]}

Dong Lianhe ^{[1
]}

机构：

[1] Changchun Univ Sci & Technol, Inst Optoelect Engineer, Changchun 130022, Jilin, Peoples R China

[2] Chinese Acad Sci, Natl Engn Res Ctr Optoelect Devices, Inst Semicond, Beijing 100083, Peoples R China

来源：

LASER & OPTOELECTRONICS PROGRESS | 2019年 / 56卷 / 09期

关键词：

lasers; semiconductor laser; packaging; soldering; smile effect;

D O I：

10.3788/LOP56.091402

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The 808 nm high-power semiconductor laser bars arc used for packaging to optimize the two important factors that affect the package quality: the furnace tube temperature and the soldering time. The results show that the solder layer has the least voids when the soldering time is 100 s at a tube furnace temperature of 650 degrees C. Moreover, the obtained semiconductor laser bar has the lowest smile effect value, the smallest threshold current, a more stable wavelength, and the best soldering quality.

引用

页数：5

共 15 条

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