Uncooled Microbolometer Infrared Focal Plane Array without Substrate Temperature Stabilization

被引:0
|
作者
Liu, Huifang [1 ]
Que, Longcheng
Niu, Runmei
Yuan, Kai
机构
[1] Univ Elect Sci & Technol China, State Key Lab Elect Thin Films, Chengdu 610054, Peoples R China
关键词
UIFPA; Readout Circuits; TEC; Substrate Temperature Compensation; Micro-bolometer;
D O I
暂无
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
This paper put forwards a particular compensation structure for uncooled micro-bolometer without substrate temperature stabilization. Compared with the basic signal readout circuit, the proposed compensation method allows the micro-bolometer array non-uniformity control over a wider range of readout integrated circuits substrate temperature. When the substrate temperature variation is 60 degrees C, the voltage span is no more than 500 mV at Tscene = 285K of output voltage. As a result of the elimination of temperature stabilization requirement, power, volume, and weight of uncooled infrared focal plane array (UIFPA) are also significantly reduced.
引用
收藏
页码:55 / 58
页数:4
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