Solving heat conduction problems in Mathematica environment

被引：0
|
作者：
Mykhalchuk, M [1 ]
Fedasyuk, D [1 ]
机构：
[1] Natl Univ Lvivska Polytech, CAD Dept, UA-79046 Lvov, Ukraine
来源：
EXPERIENCE OF DESIGNING AND APPLICATION OF CAD SYSTEMS IN MICROELECTRONICS | 2001年
关键词：
heat conduction; symbolic computation; Mathematica;
D O I：
10.1109/CADSM.2001.975794
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper considers the application of new symbolic computation tools for solving heat conduction problems in microelectronics.
引用
收藏
页码：164 / 165
页数：2
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