An Industry 4.0 Cyber-Physical Framework for Micro Devices Assembly

被引:0
|
作者
Cecil, J. [1 ]
Albuhamood, Sadiq [1 ]
Cecil-Xavier, Aaron [2 ,3 ]
机构
[1] Oklahoma State Univ, Comp Sci Dept, Ctr Cyber Phys Syst, Stillwater, OK 74078 USA
[2] Ctr Cyber Phys Syst, Stillwater, OK USA
[3] Stillwater High Sch, Stillwater, OK USA
基金
美国国家科学基金会;
关键词
INTERNET; THINGS; SYSTEMS;
D O I
暂无
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
An advanced cyber manufacturing framework to support the collaborative assembly of micro devices is presented based on Industry 4.0 principles. The distributed cyber and physical components work together to plan, assemble and monitor micro assembly related tasks; micro assembly refers to the assembly of micron sized devices which cannot be manufactured by MEMS technologies. The collaborative framework proposed includes assembly planning and path planning modules, Virtual Reality based assembly simulation environments and physical assembly work cells. An ontology based approach was implemented to address semantic interoperability issues to support formation of temporary partnerships in a Virtual Enterprise context. The key to the design and implementation of this complex framework is an information centric process modeling approach which provides a data/information oriented basis for collaboration. A collaborative cyber physical test bed has been built to demonstrate feasibility of proposed framework and approach.
引用
收藏
页码:427 / 432
页数:6
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