Characterisation of thermal diode panels for use in the cooling season in buildings

被引：63

作者：

Varga, S ^{[1
]}

Oliveira, AC ^{[1
]}

Afonso, CF ^{[1
]}

机构：

[1] Univ Porto, Fac Engn, Dept Mech Engn & Ind Management, P-4200465 Oporto, Portugal

来源：

ENERGY AND BUILDINGS | 2002年 / 34卷 / 03期

关键词：

thermal diode; heat pipe; numerical model; thermal properties;

D O I：

10.1016/S0378-7788(01)00090-1

中图分类号：

TU [建筑科学];

学科分类号：

0813 ;

摘要：

Thermal diode panels, incorporating heat pipes, were tested under cooling season conditions. Their thermophysical properties were evaluated by measuring temperature distributions in an experimental test facility and by using numerical simulation together with an optimisation procedure. The method allowed the quantification of thermal characteristics for both operating modes: forward and backward heat transfer. Forward heat transfer led to an apparent thermal conductivity up to five times, the one for backward mode. (C) 2002 Elsevier Science B.V. All rights reserved.

引用

页码：227 / 235

页数：9

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