Phase formation and thermal stability of periodic Ni-silicide nanocontact arrays on epitaxial Si1-xCx layers on Si(100)

被引:0
|
作者
Cheng, S. L. [1 ]
Tseng, Y. C. [1 ]
Lee, S. W. [2 ]
Chen, H. [1 ]
机构
[1] Natl Cent Univ, Dept Chem & Mat Engn, Chungli 32054, Taoyuan, Taiwan
[2] Natl Cent Univ, Inst Mat Sci & Engn, Chungli 32054, Taoyuan, Taiwan
关键词
Si1-xCx; Nanosphere lithography; Ni silicide; Nanocontact; Phase formation; NANOSPHERE LITHOGRAPHY; CONTROLLED GROWTH; NISI2; NANOWIRES; (001)SI;
D O I
10.1016/j.apsusc.2012.05.079
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
We report here on the first study of the interfacial reactions of nanoscale Ni metal dots on single-crystal Si1-xCx(1 0 0) substrates at various heat treatments. The formation of high-resistivity NiSi2 phase was found to be more favorable for the miniature size Ni nanodots. The incorporation of C to Si substrates exhibited significant beneficial effects on improving the thermal stability of low-resistivity NiSi nanocontacts. The process window of low-resistivity NiSi in the Ni nanodots/Si1-xCx(1 0 0) sample was greatly extended by 200-250 degrees C as compared to that in the Ni nanodots/Si(1 0 0) sample. The presence of C atoms is thought to lower the NiSi nanocontact/Si1-xCx interface energy and/or to block the Ni diffusion paths during high temperature annealing. For the Ni nanodots/Si1-xCx(1 0 0) sample annealed at 900 degrees C, highly curled and tangled amorphous SiOx nanowires with diameters of 8-20 nm were found to form. The growth process of these amorphous SiOx nanowires could be explained by the solid-liquid-solid (SLS) mechanism. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码:8713 / 8718
页数:6
相关论文
共 50 条
  • [1] Erbium Silicide Formation on Si1-xCx Epitaxial Layers
    Alptekin, Emre
    Ozturk, Mehmet C.
    Misra, Veena
    Cho, Yonah
    Kim, Yihwan
    Chopra, Saurabh
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2009, 156 (05) : H378 - H383
  • [2] Schottky Barrier Height of Nickel Silicide Contacts Formed on Si1-xCx Epitaxial Layers
    Alptekin, Emre
    Ozturk, Mehmet C.
    IEEE ELECTRON DEVICE LETTERS, 2009, 30 (12) : 1320 - 1322
  • [3] Electrical demonstration of thermally stable Ni silicides on Si1-xCx epitaxial layers
    Machkaoutsan, V.
    Verheyen, P.
    Bauer, M.
    Zhang, Y.
    Koelling, S.
    Franquet, A.
    Vanormelingen, K.
    Loo, R.
    Kim, C. S.
    Lauwers, A.
    Horiguchi, N.
    Kerner, C.
    Hoffmann, T.
    Granneman, E.
    Vandervorst, W.
    Absil, P.
    Thomas, S. G.
    MICROELECTRONIC ENGINEERING, 2010, 87 (03) : 306 - 310
  • [4] The formation and stability of Si1-xCx alloys in Si implanted with carbon
    Wang, YS
    Li, JM
    Jin, YF
    Wang, YT
    Sun, GS
    Lin, LY
    CHINESE SCIENCE BULLETIN, 2001, 46 (03): : 200 - 204
  • [5] Energetics and equilibrium properties of thin pseudomorphic Si1-xCx(100) layers in Si
    Kelires, PC
    Kaxiras, E
    PHYSICAL REVIEW LETTERS, 1997, 78 (18) : 3479 - 3482
  • [6] The formation and stability of Si1-xCx alloys in Si implanted with carbon ions
    WANG Yinshu
    2. Institute of Semiconductors
    3. Institute of Modern Physics
    Science Bulletin, 2001, (03) : 200 - 204
  • [7] THERMAL-STABILITY OF SI1-XCX/SI STRAINED LAYER SUPERLATTICES
    GOORSKY, MS
    IYER, SS
    EBERL, K
    LEGOUES, F
    ANGILELLO, J
    CARDONE, F
    APPLIED PHYSICS LETTERS, 1992, 60 (22) : 2758 - 2760
  • [8] Molecular beam epitaxial grown Si1-xCx layers on Si(001) as a substrate for MWCVD of diamond
    Gutheit, T
    Heinau, M
    Fusser, HJ
    Wild, C
    Koidl, P
    Abstreiter, G
    JOURNAL OF CRYSTAL GROWTH, 1995, 157 (1-4) : 426 - 430
  • [9] Ultrathin epitaxial Ni-silicide contacts on (100) Si and SiGe: Structural and electrical investigations
    Zhao, Qing-Tai
    Knoll, Lars
    Zhang, Bo
    Buca, Dan
    Hartmann, Jean-Michel
    Mantl, Siegfried
    MICROELECTRONIC ENGINEERING, 2013, 107 : 190 - 195
  • [10] Ni silicide formation on epitaxial Si1-yCy/(001) layers
    Lee, S. W.
    Huang, S. H.
    Cheng, S. L.
    Chen, P. S.
    Wu, W. W.
    THIN SOLID FILMS, 2010, 518 (24) : 7394 - 7397