Hot deformation behavior of squeeze casting SiCp/2A50 matrix composites

The flow stress behaviors of squeeze casting SiCp/2A50 matrix composites were investigated by means of compression tests on a Gleeble 1500 therma1 mechanical simulator at isothermal constant strain rates ranging from of 0.001 to 1.0 with the testing temperature ranging from 350 to 500A degrees C. The experiments showed that the relationship between stress and strain was obviously influenced by the strain rate and temperature. Dynamic recrystallization generally occurred at a higher temperature and a 1ower strain rate. A linear equation could be fitted between the Zener-Hollomon parameter Z and stress in the experiments. The mean value reciprocal of temperature at every true strain had a linear relation with natural logarithm of Z parameter, and the correlation coefficient, R=0.99, which was very significant by examination. The hot deformation activation energy of SiCp/2A50 matrix composites was 163.47 KJ/mol by calculation.