Progress on the realization of the electron column modules for SCALPEL high-throughput/alpha electron projection lithography tools

被引:0
|
作者
Stenkamp, D [1 ]
Kienzle, O [1 ]
Orchowski, A [1 ]
Rau, WD [1 ]
Weickenmeier, A [1 ]
Benner, G [1 ]
Wetzke, M [1 ]
Waskiewicz, W [1 ]
Katsap, V [1 ]
Zhu, X [1 ]
Liu, H [1 ]
Munro, E [1 ]
Rouse, JA [1 ]
机构
[1] Carl Zeiss Lithos GmbH, D-73447 Oberkochen, Germany
来源
关键词
SCALPEL; electron projection lithography; next generation lithography;
D O I
10.1117/12.436642
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
With the production of the first High-Throughput Alpha Tools, Electron Beam Projection Lithography (EPL) is entering the commercialization phase. Here, we report on the realization of the electron column modules for the SCALPEL HT/Alpha EPL systems, designed to demonstrate high wafer throughput at resolutions at and below 100 nm. We describe our highly modular setup of each electron optical component targeted at maximum flexibility and enabling a fast and smooth evolution towards higher throughput and resolution. By applying strict design and process rules we were able to set-up the complete production flow from the design, construction and manufacturing of the components of the ferrite/dielectric deflector based projection optics up to established qualification schemes within less than one year. A crucial point for the overall tool performance is the timely availability of system alignment and metrology strategies. Here we adapt state-of-the-art techniques from light optical lens manufacturing to a maximum amount. We discuss our metrology and alignment approach based on aerial image analysis combined with extensive electron optical imaging simulations and present first theoretical and experimental sub-100 nm results.
引用
收藏
页码:115 / 125
页数:11
相关论文
共 50 条
  • [1] Progress on the realization of the electron column modules for SCALPEL high-throughput/alpha electron projection lithography tools
    Stenkamp, D
    Kienzle, O
    Orchowski, A
    Rau, WD
    Weickenmeier, A
    Benner, G
    Wetzke, M
    Waskiewicz, W
    Katsap, V
    Zhu, X
    Liu, H
    Munro, E
    Rouse, JA
    MICROELECTRONIC ENGINEERING, 2001, 57-8 : 137 - 143
  • [2] Electron projection lithography: Progress on the electron column modules for SCALPEL High-Throughput/Alpha exposure tools
    Stenkamp, D
    Hertfelder, C
    Kienzle, O
    Orchowski, A
    Rau, WD
    Weickenmeier, A
    Waskiewicz, W
    LITHOGRAPHY FOR SEMICONDUCTOR MANUFACTURING II, 2001, 4404 : 325 - 334
  • [3] MARK DETECTION FOR ALIGNMENT AND REGISTRATION IN A HIGH-THROUGHPUT PROJECTION ELECTRON LITHOGRAPHY TOOL
    FARROW, RC
    LIDDLE, JA
    BERGER, SD
    HUGGINS, HA
    KRAUS, JS
    CAMARDA, RM
    JURGENSEN, CW
    KOLA, RR
    FETTER, L
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1992, 10 (06): : 2780 - 2783
  • [4] High-throughput electron beam stepper lithography
    Okamoto, Kazuya
    Suzuki, Kazuaki
    Pfeiffer, Hans C.
    Sogard, Michael
    Microlithography World, 2000, 9 (01):
  • [5] Space-charge limitations to throughput in projection electron-beam lithography (SCALPEL)
    Liddle, J.A.
    Blakey, M.I.
    Knurek, C.S.
    Mkrtchyan, M.M.
    Novembre, A.E.
    Ocola, L.
    Saunders, T.
    Waskiewicz, W.K.
    Microelectronic Engineering, 1998, 41-42 : 155 - 158
  • [6] Space-charge limitations to throughput in projection electron-beam lithography (SCALPEL)
    Liddle, JA
    Blakey, MI
    Knurek, CS
    Mkrtchyan, MM
    Novembre, AE
    Ocola, L
    Saunders, T
    Waskiewicz, WK
    MICROELECTRONIC ENGINEERING, 1998, 42 : 155 - 158
  • [7] Reflective electron-beam lithography: progress toward high-throughput production capability
    Freed, Regina
    Gubiotti, Thomas
    Sun, Jeff
    Kidwingira, Francoise
    Yang, Jason
    Ummethala, Upendra
    Hale, Layton C.
    Hench, John J.
    Kojima, Shinichi
    Mieher, Walter D.
    Bevis, Chris F.
    Lin, Shy-Jay
    Wang, Wen-Chuan
    ALTERNATIVE LITHOGRAPHIC TECHNOLOGIES IV, 2012, 8323
  • [8] High-throughput realization of an infrared selective absorber/emitter by DUV microsphere projection lithography
    Bonakdar, Alireza
    Rezaei, Mohsen
    Dexheimer, Eric
    Mohseni, Hooman
    NANOTECHNOLOGY, 2016, 27 (03)
  • [9] HIGH-THROUGHPUT, HIGH-RESOLUTION ELECTRON-BEAM LITHOGRAPHY
    PFEIFFER, HC
    GROVES, TR
    NEWMAN, TH
    IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1988, 32 (04) : 494 - 501
  • [10] Projection exposure with variable axis immersion lenses: A high-throughput electron beam approach to ''suboptical'' lithography
    Pfeiffer, HC
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1995, 34 (12B): : 6658 - 6662