Effect of Process Parameters and Material Properties on Laser Micromachining of Microchannels

被引:40
|
作者
Benton, Matthew [1 ]
Hossan, Mohammad Robiul [1 ,2 ]
Konari, Prashanth Reddy [1 ]
Gamagedara, Sanjeewa [2 ,3 ]
机构
[1] Univ Cent Oklahoma, Dept Engn & Phys, Edmond, OK 73034 USA
[2] Univ Cent Oklahoma, Ctr Interdisciplinary Biomed Educ & Res, Edmond, OK 73034 USA
[3] Univ Cent Oklahoma, Dept Chem, Edmond, OK 73034 USA
来源
MICROMACHINES | 2019年 / 10卷 / 02期
基金
美国国家卫生研究院; 美国国家科学基金会;
关键词
laser micromachining; laser ablation; microchannels; microfabrication; laser system parameters; modeling of laser micromachining; PMMA; ABLATION; PROTEIN; FABRICATION; SEPARATION; CHIPS;
D O I
10.3390/mi10020123
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
Laser micromachining has emerged as a promising technique for mass production of microfluidic devices. However, control and optimization of process parameters, and design of substrate materials are still ongoing challenges for the widespread application of laser micromachining. This article reports a systematic study on the effect of laser system parameters and thermo-physical properties of substrate materials on laser micromachining. Three dimensional transient heat conduction equation with a Gaussian laser heat source was solved using finite element based Multiphysics software COMSOL 5.2a. Large heat convection coefficients were used to consider the rapid phase transition of the material during the laser treatment. The depth of the laser cut was measured by removing material at a pre-set temperature. The grid independent analysis was performed for ensuring the accuracy of the model. The results show that laser power and scanning speed have a strong effect on the channel depth, while the level of focus of the laser beam contributes in determining both the depth and width of the channel. Higher thermal conductivity results deeper in cuts, in contrast the higher specific heat produces shallower channels for a given condition. These findings can help in designing and optimizing process parameters for laser micromachining of microfluidic devices.
引用
收藏
页数:12
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