Development of high-density single-mode polymer waveguides with low crosstalk for chip-to-chip optical interconnection

被引：15

作者：

Sugama, Akio ^{[1
,2
]}

Kawaguchi, Kenichi ^{[2
]}

Nishizawa, Motoyuki ^{[2
]}

Muranaka, Hidenobu ^{[2
]}

Arakawa, Yasuhiko ^{[1
,3
]}

机构：

[1] Univ Tokyo, Inst Nano Quantum Informat Elect, Meguro Ku, Tokyo 1538505, Japan

[2] Fujitsu Labs Ltd, Atsugi, Kanagawa 2430197, Japan

[3] Univ Tokyo, Inst Ind Sci, Meguro Ku, Tokyo 1538505, Japan

来源：

OPTICS EXPRESS | 2013年 / 21卷 / 20期

关键词：

Optical interconnects - Optical waveguides - Waveguide components - Integrated circuit interconnects;

D O I：

10.1364/OE.21.024231

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

High-density single-mode polymer waveguides were fabricated for chip-to-chip optical interconnection. The waveguides were designed as minimized mode field diameters for the lowest inter-channel crosstalk caused by mode coupling. The optimum relative index difference chosen was 1.2% to ensure compatibility with low crosstalk and wide fabrication tolerances. The 60-mm-length linear waveguides demonstrated a low propagation loss of 0.6 dB/cm and -45 dB crosstalk at 1310 nm. Also, a new crosstalk mechanism for a curved waveguide was revealed. (C) 2013 Optical Society of America

引用

页码：24231 / 24239

页数：9

共 50 条

[1] A self-forming compact polymer waveguide for efficient chip-to-chip single-mode interconnection based on radiation mode coupling
Deng, KL
Shih, MY
Tolliver, T
Guida, R
Gorczyca, T
Nielsen, M
2003 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2, 2003, : 366 - 367
[2] Self-aligned single-mode polymer waveguide interconnections for efficient chip-to-chip optical coupling
Deng, Kung-Li
Gorczyca, Thomas
Lee, Boon K.
Xia, Hua
Guida, Renato
Karras, Thomas
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 2006, 12 (05) : 923 - 930
[3] High-speed on-chip and chip-to-chip optical interconnection
Tsuda, H
Nakahara, T
FUNDAMENTAL PROBLEMS OF OPTOELECTRONICS AND MICROELECTRONICS, 2003, 5129 : 18 - 23
[4] 5-Gb/s chip-to-chip optical interconnection using polymeric waveguides
Kim, Do-Won
Cho, In-Kui
Ahn, Seung Ho
Park, Hyo-Hoon
2007 PACIFIC RIM CONFERENCE ON LASERS AND ELECTRO-OPTICS, VOLS 1-4, 2007, : 243 - 244
[5] Single-mode Glass Waveguide Platform for DWDM Chip-to-Chip Interconnects
Brusberg, Lars
Schroeder, Henning
Queisser, Marco
Lang, Klaus-Dieter
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 1532 - 1539
[6] Low Loss Chip-to-Chip Couplers for High-Density Co-Packaged Optics
Weninger, Drew
Serna, Samuel
Ranno, Luigi
Kimerling, Lionel
Agarwal, Anuradha
ADVANCED ENGINEERING MATERIALS, 2025, 27 (04)
[7] Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems
Nieweglowski, Krzysztof
Lorenz, Lukas
Luengen, Sebastian
Tiedje, Tobias
Wolter, Klaus-Juergen
Bock, Karlheinz
MICROELECTRONICS RELIABILITY, 2018, 84 : 121 - 126
[8] Compact and High-Density Opto-electronic Transceiver Module for Chip-to-Chip Optical Interconnects
Mori, Tetsuya
Fujiwara, Makoto
Terada, Shinsuke
Choki, Koji
2011 OPTICAL FIBER COMMUNICATION CONFERENCE AND EXPOSITION (OFC/NFOEC) AND THE NATIONAL FIBER OPTIC ENGINEERS CONFERENCE, 2011,
[9] CALCULATION OF CAPACITANCES OF CHIP-TO-CHIP INTERCONNECTIONS ON A HIGH-DENSITY MULTICHIP PACKAGE
NAYAK, D
HWANG, LT
TURLIK, I
PROCEEDINGS OF THE TECHNICAL CONFERENCE : EIGHTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, 1988, : 202 - 212
[10] High-speed and high-density chip-to-chip interconnections: Trends and techniques
Schmatz, ML
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2000, : 23 - 24

← 1 2 3 4 5 →