High Performance, Ultra High Voltage 4H-SiC IGBTs

被引:0
|
作者
Ryu, Sei-Hyung [1 ]
Capell, Craig [1 ]
Cheng, Lin [1 ]
Jonas, Charlotte [1 ]
Gupta, Anand [1 ]
Donofrio, Matt [1 ]
Clayton, Jack [1 ]
O'Loughlin, Michael [1 ]
Burk, Al [1 ]
Grider, David [1 ]
Agarwal, Anant [1 ]
Palmour, John [1 ]
Hefner, Allen [2 ]
Bhattacharya, Subhashish [3 ]
机构
[1] Cree Inc, Durham, NC USA
[2] NIST, Gaithersburg, MD 20899 USA
[3] North Carolina State Univ, FREEDM Syst Ctr, Raleigh, NC 27695 USA
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暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present our latest developments in ultra high voltage 4H-SiC IGBTs. A 4H-SiC P-IGBT, with a chip size of 6.7 mm x 6.7 mm and an active area of 0.16 cm(2) exhibited a record high blocking voltage of 15 kV, while showing a room temperature differential specific on-resistance of 24 m Omega-cm(2) with a gate bias of -20 V. A 4H-SiC N-IGBT with the same area showed a blocking voltage of 12.5 kV, and demonstrated a room temperature differential specific on-resistance of 5.3 m Omega-cm(2) with a gate bias of 20 V. Buffer layer design, which includes controlling the doping concentration and the thickness of the field-stop buffer layers, was used to control the charge injection from the backside. Effects on buffer layer design on static characteristics and switching behavior are reported.
引用
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页码:3603 / 3608
页数:6
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