Full-Wave Analysis of Microstrip Circuits with Reciprocal Matrix Compression Technique

We propose an efficient full-wave simulation method for microstrip circuits with reciprocal multilevel matrix compression method (rMLMCM). The mixed potential integral equation (MPIE) with the layered media Green's function is applied to the exterior layers of the packed interconnects. With quadtree structure, the dense impedance matrix is split up into the "near" and "far" terms according to the admission condition. The "near" term block matrices are full-rank, they are evaluated by the method of moments (MoM) directly. While the "far" term block matrices are low-rank, they are sparse filled and compressed by the rMLMCM. The rMLMCM low-rank approximation precisions of the block impedance matrices with respect to the decomposition thresholds are tested in detail. The current densities on the large-scale interconnects at high frequency are extracted much more effectively with the rMLMCM over the standard rank based methods. Numerical results demonstrate the validity of the proposed method.