Orthogonal Wideband (DC-10 GHz) Microstrip-to-Microstrip Transition using Flexible LCP Interconnects

被引：0
|
作者：
McQuaide, Dylan [1 ]
Khan, Wasif [1 ]
Guidoni, Luca [2 ]
Ruzzene, Massimo [2 ]
Papapolymerou, John [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
[2] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA
来源：
2014 44TH EUROPEAN MICROWAVE CONFERENCE (EUMC) | 2014年
关键词：
Orthogonal Interconnect; LCP; broadband interconnect;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents an orthogonal, broadband microstrip-to-microstrip RF transition at the board level. The transition was achieved by bonding a single metal trace fabricated on Rogers Ultralam 3850 Liquid Crystal Polymer (LCP) substrate to microstrip lines made on RO3003 substrates. 3D FEM simulations in Ansoft HFSS and measured data show that S-21 for this transition is less than 1 dB over a wide range of frequencies from DC-9.5 GHz. The insertion loss per unit length remains below 0.5 dB/cm below approximately 10 GHz.
引用
收藏
页码：1781 / 1784
页数：4
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