Laser sintering of gold nanoparticles on a copper substrate toward an alternative to gold plating

被引：3
|
作者：
Watanabe, Akira [1 ]
机构：
[1] Tohoku Univ, Inst Multidisciplinary Res Adv Mat, Aoba Ku, Sendai, Miyagi 9808577, Japan
来源：
LASER-BASED MICRO- AND NANOPACKAGING AND ASSEMBLY VII | 2013年 / 8608卷
关键词：
laser sintering; laser direct writing; gold plating; copper substrate; metal nanoparticle ink; copper diffusion; depth profile analysis; alternative to gold plating; DIFFUSION; FABRICATION;
D O I：
10.1117/12.2001848
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The laser sintering of gold nanoparticles on a copper substrate was studied to develop an alternative to gold plating. The major problem in the gold coating on a copper substrate using gold nanoparticle ink is that copper atom easily diffuses to the surface through the gold layer and to form an oxide layer during the thermal sintering of gold nanoparticles. The depth profile of elemental composition of laser-sintered gold layer showed that the effective reduction of the diffusion of copper atom through the gold layer is possible because the laser sintering of metal nanoparticles is extremely fast process due to the nano-heater effect caused by the laser excitation of plasmon band.
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页数：8
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