The effect of polyimide imidization conditions on adhesion strength of thin metal films on polyimide substrates

The effects of Ar+ RF plasma precleaning and polyimide curing conditions on the peel strength between Al thin films and polyimides have been studied. The BPDA-PDA polyimide precursor of PI-2611 (Du Pont) was spin-coated and cured under various imidization conditions. The cured polyimide substrates were in-situ Ar+ RF plasma cleaned prior to metal deposition. Al-1 % Si-0.5 % Cu thin films were deposited onto the polyimide substrates by using DC magnetron sputtering. The peel strength was enhanced by Arf RF plasma precleaning. The Al/modified PI specimen failed cohesively in the polyimide. The polyimide curing conditions strongly affect the peel strength in the Al/modified PI system.