1μm pitch direct hybrid bonding with <300nm Wafer-to-Wafer overlay accuracy

被引：0
|
作者：
Jouve, A. [1 ,2 ]
Balan, V. [1 ,2 ]
Bresson, N. [1 ,2 ]
Euvrard-Colnat, C. [1 ,2 ]
Fournel, F. [1 ,2 ]
Exbrayat, Y. [1 ,2 ]
Mauguen, G. [1 ,2 ]
Sater, M. Abdel [1 ,2 ]
Beitia, C. [1 ,2 ]
Arnaud, L. [1 ,2 ]
Cheramy, S. [1 ,2 ]
Lhostis, S. [3 ]
Farcy, A. [3 ]
Guillaumet, S. [3 ]
Mermoz, S. [3 ]
机构：
[1] Univ Grenoble Alpes, LETI, CEA, F-38000 Grenoble, France
[2] MINATEC Campus, F-38054 Grenoble, France
[3] STMicroelectronics, 850 Rue Jean Monnet, F-38926 Crolles, France
来源：
2017 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) | 2017年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：2
相关论文
共 16 条
  • [1] <200 nm Wafer-to-Wafer Overlay Accuracy in Wafer Level Cu/SiO2 Hybrid Bonding for BSI CIS
    Rebhan, B.
    Bernauer, M.
    Wagenleitner, T.
    Heilig, M.
    Kurz, F.
    Lhostis, S.
    Deloffre, E.
    Jouve, A.
    Balan, V.
    Chitu, L.
    [J]. 2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
  • [2] 50 nm Overlay Accuracy for Wafer-to-wafer Bonding by High-precision Alignment Technologies
    Mitsuishi, Hajime
    Mori, Hiroshi
    Maeda, Hidehiro
    Ushijima, Mikio
    Kamashita, Atsushi
    Okada, Masashi
    Aramata, Masanori
    Shiomi, Takashi
    Sakamoto, Shinya
    Takahata, Kishou
    Chiba, Tomohiro
    Fukuda, Minoru
    Kanbayashi, Masahiro
    Shimoda, Toshimasa
    Sugaya, Isao
    [J]. 2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 1664 - 1671
  • [3] 0.5 μm Pitch Wafer-to-wafer Hybrid Bonding with SiCN Bonding Interface for Advanced Memory
    Ma, Kai
    Bekiaris, Nikolaos
    Ramaswami, Sesh
    Ding, Taotao
    Probst, Gernot
    Burggraf, Juergen
    Uhrmann, Thomas
    [J]. 2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 1110 - 1114
  • [4] Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding
    Kim, Soon-Wook
    Fodor, Ferenc
    Heylen, Nancy
    Iacovo, Serena
    De Vos, Joeri
    Miller, Andy
    Beyer, Gerald
    Beyne, Eric
    [J]. 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 216 - 222
  • [5] RECENT DEVELOPMENTS IN FINE PITCH WAFER-TO-WAFER HYBRID BONDING WITH COPPER INTERCONNECT
    Theil, Jeremy A.
    Mirkarimi, Laura
    Fountain, Gill
    Gao, Guilian
    Katkar, Rajesh
    [J]. 2019 INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC), 2019,
  • [6] Novel failure analysis techniques for 1.8 μm pitch wafer-to-wafer bonding
    Schmidt, Christian
    Lechner, Lorenz
    DeWolf, Ingrid
    Kim, Soon-Wook
    Beyne, Eric
    [J]. 2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 92 - 96
  • [7] Low Temperature and Fine Pitch Nanocrystalline Cu/SiCN Wafer-to-Wafer Hybrid Bonding
    Chiu, Wei-Lan
    Lee, Ou-Hsiang
    Kuo, Tzu-Ying
    Lo, James Yi-Jen
    Shih, Chiang-Lin
    Chiu, Hsih-Yang
    Chang, Hsiang-Hung
    [J]. 2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 1105 - 1109
  • [8] Scalable, sub 2μm Pitch, Cu/SiCN to Cu/SiCN Hybrid Wafer-to-Wafer Bonding Technology
    Beyne, Eric
    Kim, Soon-Wook
    Peng, Lan
    Heylen, Nancy
    De Messemaeker, Joke
    Okudur, Oguzhan Orkut
    Phommahaxay, Alain
    Kim, Tae-Gon
    Stucchi, Michele
    Velenis, Dimitrios
    Miller, Andy
    Beyer, Gerald
    [J]. 2017 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2017,
  • [9] Towards 5μm interconnection pitch with Die-to-Wafer direct hybrid bonding
    Bourjot, Emilie
    Castan, Clement
    Nadi, Noura
    Bond, Alice
    Bresson, Nicolas
    Sanchez, Loic
    Fournel, Frank
    Raynaud, Nicolas
    Metzger, Pascal
    Cheramy, Severine
    [J]. IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 470 - 475
  • [10] A Highly Reliable 1.4μm pitch Via-Last TSV Module for Wafer-to-Wafer Hybrid Bonded 3D-SOC Systems
    Van Huylenbroeck, Stefaan
    De Vos, Joeri
    El-Mekki, Zaid
    Jamieson, Geraldine
    Tutunjyan, Nina
    Muga, Karthik
    Stucchi, Michele
    Miller, Andy
    Beyer, Gerald
    Beyne, Eric
    [J]. 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 1035 - 1040
12