Cu-Ag core-shell nanoparticles with enhanced oxidation stability for printed electronics

被引:125
|
作者
Lee, Changsoo [1 ]
Kim, Na Rae [1 ]
Koo, Jahyun [1 ]
Lee, Yung Jong [1 ]
Lee, Hyuck Mo [1 ]
机构
[1] Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Daejeon 34141, South Korea
基金
新加坡国家研究基金会;
关键词
bimetallic nanoparticle; oxidation; galvanic displacement; conductive ink; X-RAY PHOTOELECTRON; BIMETALLIC NANOPARTICLES; COPPER NANOPARTICLES; GALVANIC REPLACEMENT; REDUCTION; NANOCUBES; NICKEL; TRANSISTOR; HYDROXIDES; DEPOSITION;
D O I
10.1088/0957-4484/26/45/455601
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this work, we synthesized uniform Cu-Ag core-shell nanoparticles using a facile two-step process that consists of thermal decomposition and galvanic displacement methods. The core-shell structure of these nanoparticles was confirmed through characterization using transmission electron microscopy, energy-dispersive spectroscopy, and x-ray diffraction. Furthermore, we investigated the oxidation stability of the Cu-Ag core-shell nanoparticles in detail. Both qualitative and quantitative x-ray photoelectron spectroscopy analyses confirm that the Cu-Ag core-shell nanoparticles have considerably higher oxidation stability than Cu nanoparticles. Finally, we formulated a conductive ink using the synthesized nanoparticles and coated it onto glass substrates. Following the sintering process, we compared the resistivity of the Cu-Ag core-shell nanoparticles with that of the Cu nanoparticles. The results of this study clearly show that the Cu-Ag core-shell nanoparticles can potentially be used as an alternative to Ag nanoparticles because of their superior oxidation stability and electrical properties.
引用
收藏
页数:9
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