Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives

被引：13
|
作者：
Ho, Li-Ngee [1 ,2 ]
Nishikawa, Hiroshi [1 ]
机构：
[1] Osaka Univ, Joining & Welding Res Inst, Osaka, Ibaraki 5670047, Japan
[2] Univ Malaysia Perlis, Sch Mat Engn, Arau 02600, Perlis, Malaysia
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2013年 / 24卷 / 06期
关键词：
MECHANICAL-PROPERTIES; COMPOSITES; HEAT; STABILITY; RESINS;
D O I：
10.1007/s10854-012-1059-0
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Effects of post curing and silane coupling agents with different functional groups such as epoxy, isocyanate and ureide on the electrical and mechanical properties of copper (Cu) filled electrically conductive adhesives (ECAs) were studied. Micron-sized Cu particles were used as conductive fillers and polyurethane resin was applied as the adhesive material. Significant differences could be observed on the as cured electrical resistivity and shear strength of the Cu filled ECAs joints prepared with different silane coupling agents. Silane coupling agents functionalized with epoxy groups yielded the lowest electrical resistivity and highest shear strength among the ECAs in this study. Besides, effect of post-curing at 170 A degrees C for 1 h on the ECAs was also investigated. Results showed that ECAs after post-curing exhibited enhanced electrical conductivity and shear strength compared to the as cured ECAs.
引用
收藏
页码：2077 / 2081
页数：5
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