Room-Temperature Bonding Technique Based on Copper Nanowire Surface Fastener

被引：13

作者：

Wang, Peng ^{[1
]}

Ju, Yang ^{[1
]}

Chen, Mingji ^{[1
]}

Hosoi, Atsushi ^{[1
]}

Song, Yuanhui ^{[1
]}

Iwasaki, Yuka ^{[1
]}

机构：

[1] Nagoya Univ, Dept Mech Sci & Engn, Nagoya, Aichi 4648603, Japan

来源：

APPLIED PHYSICS EXPRESS | 2013年 / 6卷 / 03期

基金：

日本学术振兴会;

关键词：

ARRAYS;

D O I：

10.7567/APEX.6.035001

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

A free-standing copper nanowire array was directly fabricated on a silicon substrate by improved template-assisted electrodeposition. A room-temperature bonding technique was realized by pressing two nanowire arrays against each other. The van der Waals forces between the interconnected nanowires contributed to the room-temperature bonding which exhibited good mechanical and electrical properties. Theoretical analysis further showed that a much higher mechanical strength can be obtained if most copper nanowires could interconnect with each other. (C) 2013 The Japan Society of Applied Physics

引用

页数：4

共 50 条

[1] Room-temperature electrical bonding technique based on copper/polystyrene core/shell nanowire surface fastener
Wang, Peng
Ju, Yang
Chen, Mingji
[J]. APPLIED SURFACE SCIENCE, 2015, 349 : 774 - 779
[2] Copper/Parylene Core/Shell Nanowire Surface Fastener Used for Room-Temperature Electrical Bonding
Wang, Peng
Ju, Yang
Cui, Yanbin
Hosoi, Atsushi
[J]. LANGMUIR, 2013, 29 (45) : 13909 - 13916
[3] Room Temperature Electrical Bonding Technique Based On Titled Copper Nanowire Fastener with Anisotropic Adhesion Properties
Wang, Peng
Ju, Yang
Hosoi, Atsuchi
Song, Yuanhui
[J]. 2012 12TH IEEE CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO), 2012,
[4] Core-Shell Nanowire Based Electrical Surface Fastener Used for Room-Temperature Electronic Packaging Bonding
Wang, Peng
Ju, Yang
Hosoi, Atsushi
[J]. ELECTRONIC MATERIALS LETTERS, 2014, 10 (02) : 503 - 507
[5] Core-shell nanowire based electrical surface fastener used for room-temperature electronic packaging bonding
Peng Wang
Yang Ju
Atsushi Hosoi
[J]. Electronic Materials Letters, 2014, 10 : 503 - 507
[6] A 64-pin Nanowire Surface Fastener Like a Ball Grid Array Applied for Room-temperature Electrical Bonding
Toku, Yuhki
Ichioka, Kazuma
Morita, Yasuyuki
Ju, Yang
[J]. SCIENTIFIC REPORTS, 2019, 9 (1)
[7] A 64-pin Nanowire Surface Fastener Like a Ball Grid Array Applied for Room-temperature Electrical Bonding
Yuhki Toku
Kazuma Ichioka
Yasuyuki Morita
Yang Ju
[J]. Scientific Reports, 9
[8] Direct bonding of a laser crystal and Copper by use of the room-temperature bonding
Matsui, Tomoki
Katsumata, Shin
Shoji, Ichiro
[J]. 2017 CONFERENCE ON LASERS AND ELECTRO-OPTICS PACIFIC RIM (CLEO-PR), 2017,
[9] Stamp-and-stick room-temperature bonding technique for microdevices
Satyanarayana, S
Karnik, RN
Majumdar, A
[J]. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2005, 14 (02) : 392 - 399
[10] A hermetic and room-temperature wafer bonding technique based on integrated reactive multilayer systems
Braeuer, J.
Gessner, T.
[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2014, 24 (11)

← 1 2 3 4 5 →