Design and Fabrication of Low-loss Horizontal and Vertical Interconnect Links using Air-Clad Transmission Lines and Through Silicon Vias

被引：0

作者：

Sharma, Rohit ^{[1
]}

Uzunlar, Erdal ^{[1
]}

Kumar, Vachan ^{[1
]}

Saha, Rajarshi ^{[1
]}

Yeow, Xinyi ^{[1
]}

Bashirullah, Rizwan ^{[2
]}

Naeemi, Azad ^{[1
]}

Kohl, Paul ^{[1
]}

机构：

[1] Georgia Inst Technol, Interconnect Focus Ctr, Atlanta, GA 30332 USA

[2] Univ Florida, Dept Elect & Comp Engn, Gainesville, FL 32611 USA

来源：

2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2012年

关键词：

THROUGH-SILICON; GAPS; MODEL;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

In this paper we present the design and fabrication of air-clad planar transmission lines and TSVs that can be used as horizontal and vertical chip-chip interconnects. Performance improvement by using heterogeneous air-clad dielectric is presented for these two types of interconnect structures that establishes the basic motivation for fabricating these structures. The design data is verified by performing simulation using 3D full-wave solver HFSS. We outline the process flow for air-clad transmission lines and TSVs in detail. Several challenges in the fabrication of air-clad structures are also discussed.

引用

页码：2005 / 2012

页数：8

共 13 条

[1] Design and Fabrication of Ultra Low-loss, High-performance 3D Chip-chip Air-clad Interconnect Pathway
Uzunlar, Erdal
Sharma, Rohit
Saha, Rajarshi
Kumar, Vachan
Bashirullah, Rizwan
Naeemi, Azad
Kohl, Paul A.
2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 1425 - 1432
[2] Silicon Interposer Platform With Low-Loss Through-Silicon Vias Using Air
Oh, Hanju
May, Gary S.
Bakir, Muhannad S.
2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015), 2015,
[3] Low-Loss Air-Clad Suspended Silicon Platform for Mid-Infrared Photonics
Miller, Steven A.
Griffith, Austin G.
Yu, Mengjie
Gaeta, Alexander L.
Lipson, Michal
2016 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO), 2016,
[4] Low-loss through silicon Vias (TSVs) and transmission lines for 3D optoelectronic integration
Wang, Shuxiao
Wang, Qing
Liu, Yufei
Jia, Lianxi
Yu, Mingbin
Sun, Peng
Geng, Fei
Cai, Yan
Tu, Zhijuan
MICROELECTRONIC ENGINEERING, 2021, 238
[5] Low-Loss Air-Isolated Through-Silicon Vias for Silicon Interposers
Oh, Hanju
Thadesar, Paragkumar A.
May, Gary S.
Bakir, Muhannad S.
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2016, 26 (03) : 168 - 170
[6] Design Space Exploration of Through Silicon Vias for High-Speed, Low Loss Vertical Links
Kumar, Somesh
Kaur, Sarabjeet
Bakshi, Mayank
Bansal, Mohit
Choudhary, Mohan
Sharma, Rohit
2014 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING & SYSTEMS SYMPOSIUM (EDAPS), 2014, : 9 - 12
[7] New fabrication process for low-loss millimeter-wave transmission lines on silicon
Ishii, Hiromu
Sahri, Nabil
Nagatsuma, Tadao
Machida, Katsuyuki
Saito, Kunio
Yagi, Shouji
Yano, Masaki
Kudo, Kazuhisa
Kyuragi, Hakaru
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2000, 39 (5 B): : 1982 - 1986
[8] A new fabrication process for low-loss millimeter-wave transmission lines on silicon
Ishii, H
Sahri, N
Nagatsuma, T
Machida, K
Saito, K
Yagi, S
Yano, M
Kudo, K
Kyuragi, H
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2000, 39 (4B): : 1982 - 1986
[9] Spiral inductors and transmission lines in silicon technology using copper-damascene interconnects and low-loss substrates
Burghartz, JN
Edelstein, DC
Jenkins, KA
Kwark, YH
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1997, 45 (10) : 1961 - 1968
[10] Low-Loss Air-Cavity Through-Silicon Vias (TSVs) for High Speed Three-Dimensional Integrated Circuits (3-D ICs)
Liu, Xiaoxian
Zhu, Zhangming
Yang, Yintang
Ding, Ruixue
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2016, 26 (02) : 89 - 91

← 1 2 →