New thermosetting resin from terpenediphenol-based benzoxazine and epoxy resin

被引：6
|
作者：
Kimura, H
Murata, Y
Matsumoto, A
Hasegawa, K
Ohtsuka, K
Fukuda, A
机构：
[1] Osaka Municipal Tech Res Inst, Joto Ku, Osaka 5368553, Japan
[2] Kinki Univ, Nara 6318505, Japan
来源：
JOURNAL OF APPLIED POLYMER SCIENCE | 1999年 / 74卷 / 09期
关键词：
terpenediphenol-based benzoxazine; curing behavior; bisphenol A;
D O I：
10.1002/(SICI)1097-4628(19991128)74:9<2266::AID-APP16>3.3.CO;2-X
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
Terpenediphenol-based benzoxazine was prepared from terpenediphenol, formaline, and aniline. Curing behavior of the benzoxazine with epoxy resin and the properties of the cured resin were investigated. Consequently, the curing reaction did not proceed at low temperatures, but it proceeded rapidly at higher temperatures without a curing accelerator. The properties of the cured resin both from neat resins and from reinforced resins with fused silica were evaluated, respectively. The cured resins showed good heat resistance, mechanical properties, electrical insulation, and especially mater resistance, compared with the cured resin from bisphenol A type novolac and epoxy resin. (C) 1999 John Wiley & Sons, Inc.
引用
收藏
页码：2266 / 2273
页数：8
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