Mask aligner lithography simulation - From lithography simulation to process validation

被引:11
|
作者
Motzek, K. [1 ]
Partel, S. [2 ]
Bramati, A. [3 ]
Hofmann, U. [4 ]
Uenal, N. [4 ]
Hennemeyer, M. [5 ]
Hornung, M. [5 ]
Heindl, A. [6 ]
Ruhland, M. [6 ]
Erdmann, A. [1 ]
Hudek, P. [2 ]
机构
[1] Fraunhofer IISB, D-91058 Erlangen, Germany
[2] Vorarlberg Univ Appl Sci, Dornbirn, Austria
[3] SUSS MicroOpt SA, CH-2000 Neuchatel, Switzerland
[4] GenISys GmbH, D-82024 Taufkirchen, Germany
[5] SUSS MicroTec Lithog GmbH, D-85748 Garching, Germany
[6] Osrarn Opto Semicond GmbH, D-93055 Regensburg, Germany
关键词
Optical lithography; Mask aligner; Proximity printing; Photoresist; Dissolution rate monitor;
D O I
10.1016/j.mee.2012.07.076
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Based on the comparison between simulated and experimental results, we investigate the predictive qualities of mask aligner lithography simulation. Using a properly calibrated photoresist development model, it is possible to predict photoresist profiles with good quantitative accuracy. Dissolution rate monitors are shown to be an excellent tool to calibrate the development models for many of the photoresists typically used in mask aligner lithography. The accurate description of the photoresist in the simulations closes the gap between process control in the clean room (which is based on the evaluation of photoresist profiles) and recent efforts to use numerical methods to optimize the optical parameters of the lithography process. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码:121 / 124
页数:4
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