3-D flash LADAR at Raytheon

被引:10
|
作者
Halmos, MJ [1 ]
Jack, M [1 ]
Asbrock, J [1 ]
Anderson, C [1 ]
Bailey, S [1 ]
Chapman, G [1 ]
Gordon, E [1 ]
Herning, P [1 ]
Kalisher, M [1 ]
Klaras, L [1 ]
Kosai, K [1 ]
Liquori, V [1 ]
Pines, M [1 ]
Randall, V [1 ]
Reeder, R [1 ]
Rosbeck, J [1 ]
Sen, S [1 ]
Trotta, P [1 ]
Wetzel, P [1 ]
Hunter, A [1 ]
Jensen, J [1 ]
DeLyon, T [1 ]
Trussell, W [1 ]
Hutchinson, A [1 ]
Balcerak, R [1 ]
机构
[1] Raytheon Elect Syst, El Segundo, CA 90245 USA
关键词
D O I
10.1117/12.440096
中图分类号
TP7 [遥感技术];
学科分类号
081102 ; 0816 ; 081602 ; 083002 ; 1404 ;
摘要
Raytheon has recently been funded by DARPA to develop an FPA for single shot eyesafe ladar operation. The goal of the program is to develop new high speed imaging arrays to rapidly acquire high resolution, three dimensional images of tactical targets at ranges as long as 7 to 10 kilometers. This would provide precision strike, target identification from rapidly moving platforms, such as air-to-ground seekers, which would enhance counter-counter measure (CCM) performance and the ability to lock-on after launch. Also a goal is to demonstrate the acquisition of hidden, camouflaged and partially obscured targets. Raytheon's approach consists of using HgCdTe APD arrays which offer unique advantages for high performance eyesafe LADAR sensors. These include: eyesafe operation at room temperature, low excess noise, high gain to overcome thermal and preamp noise, GHz bandwidth and high packing density. The detector array will be coupled with a Readout Integrated Circuit, ROIC, that will capture all the information required for accurate range determination. The two components encompass a hybrid imaging array consisting of two IC circuit chips vertically integrated via an array of indium metal "bumps." The chip containing the APD detector array and the silicon signal processing readout chip are independently optimized to provide the highest possible performance for each function.
引用
收藏
页码:84 / 97
页数:14
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