Thermal deflection and thermal stresses in a thin circular plate under an axisymmetric heat source

被引:30
|
作者
Elsheikh, A. H. [1 ,2 ]
Guo, Jiajie [1 ]
Lee, Kok-Meng [1 ,3 ]
机构
[1] Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Hubei, Peoples R China
[2] Tanta Univ, Dept Prod Engn & Mech Design, Tanta, Egypt
[3] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA
基金
中国国家自然科学基金; 美国国家科学基金会;
关键词
Green's function; heat conduction; thermal deflection; thermal stresses; thin-wall plate; CONDUCTION PROBLEM; TEMPERATURE; SIMULATION; ALGORITHM; DISK;
D O I
10.1080/01495739.2018.1482807
中图分类号
O414.1 [热力学];
学科分类号
摘要
Motivated by the need to investigate thermal effects on the deflection and stresses in a thin-wall workpiece during machining, the thermal problem is modeled with an axisymmetric input to emulate the heat generated at the tool-workpiece interface in a turning process. Using a compressor disk as an illustrative example, the boundary value problem is formulated with a plate model where the perimetric edge is clamped and insulated, and the upper and lower surfaces are subjected to heat convection. The closed form solution of temperature distribution is obtained via Green's function method, based on which the thermal deflection/stresses are obtained in serial forms from the plate constitutive relations. The obtained solutions have been numerically verified with finite-element analysis (FEA), where simulations have been performed for three different materials with discrepant thermomechanical properties to study the thermal effects on the induced deflection and stresses. The analytical result is justified by its good agreement with FEA and its time efficiency in computation offers advantages in potential real-time application to manufacturing process monitoring.
引用
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页码:361 / 373
页数:13
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