Technologies for Integrated mm-Wave Antennas

被引：0
|
作者：
Brebels, S. [1 ]
Enayati, A. [2 ]
Soens, C. [1 ]
De Raedt, W. [1 ]
Van der Perre, L. [1 ]
Vandenbosch, G. A. E. [3 ]
机构：
[1] IMEC, SSET, Leuven, Belgium
[2] E&C Anecho Chambers, Westerlo, Belgium
[3] Katholieke Univ Leuven, ESAT TELEMIC, Leuven, Belgium
来源：
2014 8TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION (EUCAP) | 2014年
关键词：
Antenna package; organic substrate; LTCC; thin-film; millimeter wave antennas; unlicensed 60 GHz band;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
High datarate applications are possible by exploiting the large bandwidth offered at mm-wave frequencies. Realization of antenna modules is however not trivial at these high frequencies due to the increased material losses and higher sensitivity to manufacturing tolerances. In this paper, we study the suitability of three packaging technologies (organic, LTCC and thin-film) for the integration of 60 GHz active phased array modules. Both the antenna and interconnect performance is investigated.
引用
收藏
页码：727 / 731
页数：5
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