Surface stoichiometry and structural properties of copper-containing sol-gel SiO2 films

A study of the surface stoichiometry and structural properties of composite, copper-containing, silica thin films (Cu:SiO2) is presented. The films are prepared on glass substrates by a sol-gel route. The coatings deposited by a dipping process are thermally treated under oxidative and subsequently reductive conditions Lip to 500 degrees C for metal nanoparticle formation. The coating structure, the nanoparticle formation, the copper diffusion, and the chemical composition of the surface are investigated using X-ray diffraction (XRD), UV-vis spectroscopy, heavy ion rutherford backscattering spectroscopy (HIRBS), and X-ray photo-electron spectroscopy (XPS) as analytical methods. HIRBS spectrum, showing the Cu distribution of samples studied: a) as prepared, b) after heating under oxidative, and c) after heating under reductive conditions, Using C-12(3+) ions at 10 MeV.