Compression Bonding Behavior and Interfacial Microstructural Evolution of GH4169 Superalloy

In order to simulate the hot-rolling composite technology of GH4169 superalloy, the hot isothermal compression bonding tests were performed on an MSS-200 thermal simulator in the temperature range of 900 degrees C to 1100 degrees C and at strain rates of 1 similar to 10 s(-1). The Arrhenius type constitutive equation and the hot processing map were established to describe the deformation behavior of GH4169 superalloy during the compression bonding. Furthermore, the corresponding thermal deformation activation energy Q and the stress index n were calculated as 320.33 kJ.mol(-1) and 4.1573, respectively. Additionally, the bonding interfaces were observed by optical microscope (OM) and electron backscatter diffraction (EBSD) technique. The results show that the bonding interface is mainly affected by the technological parameters, and the bonding interface becomes almost invisible at 1100 degrees C with a rate of 10 s(-1).