Ceramic/Metal Composites with Positive Temperature Dependence of Thermal Conductivity

被引:2
|
作者
Li, Jianhui [1 ]
Yu, Qi [1 ]
Sun, Wei [1 ]
Zhang, Rui [1 ,3 ]
Ichigozaki, Daisuke [2 ]
Wang, Ke [1 ]
Li, Jing-Feng [1 ]
机构
[1] Tsinghua Univ, Dept Mat Sci & Engn, State Key Lab New Ceram & Fine Proc, Beijing 100084, Peoples R China
[2] Toyota Motor Co Ltd, Magnet Mat & Surface Modificat Dept, Metall & Inorg Mat Engn Div, Toyota, Aichi 4718571, Japan
[3] Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing Key Lab New Energy Mat & Technol, Beijing 100083, Peoples R China
关键词
COATINGS; STABILITY;
D O I
10.1088/1742-6596/419/1/012050
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Most materials show decreasing thermal conductivity with increasing temperature, but an opposite temperature dependence of thermal conductivity is required for some industrial applications. The present work was conducted with a motivation to develop composite materials with a positive temperature dependence of thermal conductivity. ZrO2/stainless steel powders (304L) composite, with 3% stearic acid, was prepared by normal sintering under the protecting of Ar after mixing by mechanical ball milling technique. With the 304L content increasing from 10% to 20%, the thermal conductivity values increased. For all samples, the thermal conductivity in the temperature range of room temperature to 700 degrees C decreased with temperature below 300 degrees C, and then began to increase. The increasing thermal conductivity of the composites (within the high temperature range was attributed to the difference of the thermal conductivity and thermal expansion coefficient between ZrO2 ceramic and 304L stainless steel powders. Two simple models were also used to estimate the thermal conductivity of the composites, which were in good agreement with the experiment results.
引用
收藏
页数:6
相关论文
共 50 条
  • [1] Temperature dependence of thermal conductivity in SiCp based metal-matrix composites
    Chu, K.
    Jia, C. C.
    Liang, X. B.
    Chen, H.
    [J]. MATERIALS SCIENCE AND TECHNOLOGY, 2011, 27 (01) : 91 - 94
  • [2] Dual percolation behaviors of electrical and thermal conductivity in metal-ceramic composites
    Sun, K.
    Zhang, Z. D.
    Qian, L.
    Dang, F.
    Zhang, X. H.
    Fan, R. H.
    [J]. APPLIED PHYSICS LETTERS, 2016, 108 (06)
  • [3] Thermal conductivity of ceramic/metal composites from preforms produced by freeze casting
    Hautcoeur, D.
    Lorgouilloux, Y.
    Leriche, A.
    Gonon, M.
    Nait-Ali, B.
    Smith, D. S.
    Lardot, V.
    Cambier, F.
    [J]. CERAMICS INTERNATIONAL, 2016, 42 (12) : 14077 - 14085
  • [4] Temperature dependence of effective thermal conductivity and thermal diffusivity of treated and untreated polymer composites
    Agarwal, R
    Saxena, NS
    Sharma, KB
    Thomas, S
    Sreekala, MS
    [J]. JOURNAL OF APPLIED POLYMER SCIENCE, 2003, 89 (06) : 1708 - 1714
  • [5] Effect of film thickness on the temperature dependence of thermal conductivity for diamond/BeO composites
    Luo, Hao
    Wei, Qiuping
    Yu, Z. M.
    Wang, Yijia
    Long, Hangyu
    Xie, Youneng
    [J]. CERAMICS INTERNATIONAL, 2015, 41 (09) : 12052 - 12057
  • [6] Temperature dependence of dc conductivity in poly aniline-metal halide composites
    Jain, N.
    Patidar, D.
    Saxena, N. S.
    Sharma, Kananbala
    [J]. INDIAN JOURNAL OF PURE & APPLIED PHYSICS, 2006, 44 (10) : 767 - 770
  • [7] Constitutional dependence of thermal conductivity in dispersion composites
    Xu, YB
    Kinugawa, J
    Yagi, K
    [J]. MATERIALS TRANSACTIONS, 2003, 44 (09) : 1709 - 1712
  • [8] Thermal dependence of electric conductivity in thermoplastic composites
    Sergienko, SA
    [J]. MECHANICS OF COMPOSITE MATERIALS, 1995, 31 (04) : 384 - 389
  • [9] THE TEMPERATURE DEPENDENCE OF THE THERMAL CONDUCTIVITY OF AIR
    KANNULUIK, WG
    CARMAN, EH
    [J]. AUSTRALIAN JOURNAL OF SCIENTIFIC RESEARCH SERIES A-PHYSICAL SCIENCES, 1951, 4 (03): : 305 - 314
  • [10] Temperature dependence of thermal conductivity of nanofluids
    Li Yu-Hua
    Qu Wei
    Feng Jian-Chao
    [J]. CHINESE PHYSICS LETTERS, 2008, 25 (09) : 3319 - 3322