Challenges and innovations in very-large CCD and CMOS imagers for professional imaging

被引：1

作者：

Bosiers, Jari T. ^{[1
]}

Stold, Holger ^{[1
]}

Klaassens, Wilco ^{[1
]}

Dillen, Bart ^{[1
]}

Peters, Inge ^{[1
]}

Bogaart, Erik ^{[1
]}

Frost, Raymond ^{[2
]}

Korthout, Laurens ^{[1
]}

Timpert, Jurgen ^{[1
]}

机构：

[1] DALSA Profess Imaging, High Tech Campus 23, NL-5656 AE Eindhoven, Netherlands

[2] DALSA Semicond, Bromont, PQ, Canada

来源：

SILICON PHOTONICS AND PHOTONIC INTEGRATED CIRCUITS | 2008年 / 6996卷

关键词：

CCD; CMOS; imager; stitching; digital still camera; medical imaging; X-ray imaging;

D O I：

10.1117/12.785847

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents an overview of the specific challenges that need to be overcome to make very-large CCD and CMOS imagers, and presents some recent innovations in this area. The complete development chain is described: research, production and industrialization. It will be shown that by innovative design and technology concepts, high-quality very-large area CCD and CMOS imagers can be made, even up to wafer size (6" for CCD, 8" for CMOS).

引用

页数：14

共 5 条

[1] Dark current reduction in very-large area CCD imagers for professional DSC applications
Peters, IM
Kleimann, A
Polderdijk, F
Klaassens, W
Frost, R
Bosiers, JT
[J]. IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGEST, 2004, : 993 - 996
[2] Very-large-area imagers for professional DSC applications
Dillen, B
Draijer, C
Meessen, L
Manoury, EJ
Klaassens, W
Frost, R
Bosiers, J
[J]. Digital Photography, 2005, 5678 : 14 - 24
[3] Imaging CSP: A die size optical package for CMOS imagers and CCD's
Shweky, I
Badihi, A
[J]. SENSORS AND CAMERA SYSTEMS FOR SCIENTIFIC, INDUSTRIAL AND DIGITAL PHOTOGRAPHY APPLICATIONS, 2000, 3965 : 414 - 419
[4] PIXIE III: a very large area photon-counting CMOS pixel ASIC for sharp X-ray spectral imaging
Bellazzini, R.
Brez, A.
Spandre, G.
Minuti, M.
Pinchera, M.
Delogu, P.
de Ruvo, P. L.
Vincenzi, A.
[J]. JOURNAL OF INSTRUMENTATION, 2015, 10
[5] A 28 mega pixel large area full frame CCD with 2x2 on-chip RGB charge-binning for professional digital still Imaging
Draijer, C
Polderdijk, F
van der Heide, A
Dillen, B
Klaassens, W
Bosiers, J
[J]. IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2005, TECHNICAL DIGEST, 2005, : 825 - 828

← 1 →