The Optimization of Ultrasonic Power and Bonding Time for Thermosonic Flip Chip Bonding

被引：2
|
作者：
Lim, M. R. [1 ]
Sauli, Z. [1 ,2 ]
Aris, H. [1 ]
Retnasamy, V [1 ]
Lo, C. [3 ]
Muniandy, K. [3 ]
Khan, N. [3 ]
Foong, C. S. [3 ]
机构：
[1] Univ Malaysia Perlis, Sch Microelect Engn, Pauh Putra Campus, Arau 02600, Perlis, Malaysia
[2] Univ Malaysia Kelantan, Kampus Kota, Kota Baharu 16100, Kelantan, Malaysia
[3] NXP Semicond Malaysia Sdn Bhd, Jalan SS 8-2,Sungai Way Free Trade Ind Zone, Pedaling Jaya 47300, Selangor, Malaysia
来源：
4TH ELECTRONIC AND GREEN MATERIALS INTERNATIONAL CONFERENCE 2018 (EGM 2018) | 2018年 / 2045卷
关键词：
D O I：
10.1063/1.5080907
中图分类号：
X [环境科学、安全科学];
学科分类号：
08 ; 0830 ;
摘要：
In flip chip (FC), thermosonic FC method had shown more advantages in term of bonding temperature, time and force than mass reflow and thermocompression FC. In this paper, the child die was fused with the mother die (with Cu stud bumps) by using thermosonic FC bonding. Ultrasonic power and bonding time have been studied to evaluate the die strength together with cross section and Hisomet images. Chip to chip interconnection managed to form good joints and die shear strength is 864.9 gf under optimized thermosonic FC. Medium ultrasonic power and high bonding time are beneficial for increased the die shear strength. Therefore, thermosonic FC bonding method with Cu stud bump are suitable for low count input/output (I/O) device.
引用
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页数：8
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