Vertically high-density interconnection for mobile application

There are several PWB technologies in the market that enables high density interconnection for product miniaturization, and this paper focuses on two HDI technologies, SSP and FVSS (R), and discuss the new PWB technologies and the reliability evaluation results for mobile applications. SSP is manufactured in simple lamination process using conventional FR4 materials, which enables future cost reduction and high reliability. FVSS contains filled buried via hole (BVH) and filled micro blind via (mu via) process. By combining the two process FVSS accomplishes high vertical design capability with Stacked mu via-on-mu via and stacked mu via-on-BVH designs. Key reliability requirements for final product quality is drop and temperature cycling reliability in board level in addition to evaluate PWB specific tests to compare performance of new materials used in PWB. (c) 2005 Elsevier Ltd. All rights reserved.