Nitrogen-induced transient enhanced diffusion of dopants

被引:7
|
作者
Murthy, C [1 ]
Lee, K
Rengarajan, R
Dokumaci, O
Ronsheim, P
Tews, H
Inaba, S
机构
[1] DRAM Dev Alliance, IBM Microelect, Semicond Res & Dev Ctr, Hopewell Jct, NY 12533 USA
[2] IBM Microelect, Semicond R&D Ctr, DRAM Dev Alliance, Infineon Technol, Hopewell Jct, NY 12533 USA
[3] IBM Microelect, Semicond R&D Ctr, DRAM Dev Alliance, Toshiba, Hopewell Jct, NY 12533 USA
关键词
D O I
10.1063/1.1470692
中图分类号
O59 [应用物理学];
学科分类号
摘要
Studies of both systematic experiments and detailed simulations for examining the effects of N-2(+) implant on channel dopants are described. Step-by-step monitor wafer experiments have clearly confirmed the nitrogen-induced transient enhanced diffusion (TED) of dopants. Process simulations within the "+1" N-2(+) profile approach have demonstrated the need to scale down the +1 model parameter for matching the measured depth profiles. The underlying mechanism for the reduced +1 model parameter is that nitrogen which diffuses toward the Si surface becomes a sink for the interstitials. These combined studies also show that nitrogen-induced TED of dopants increases with N-2(+) dose. (C) 2002 American Institute of Physics.
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页码:2696 / 2698
页数:3
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