Experimental and Numerical Investigation of CMT Wire and Arc Additive Manufacturing of 2205 Duplex Stainless Steel

被引:4
|
作者
Yuan, Yuheng [1 ]
Li, Ruifeng [1 ]
Bi, Xiaolin [1 ]
Gu, Jiayang [2 ]
Jiao, Chen [2 ]
机构
[1] Jiangsu Univ Sci & Technol, Sch Mat Sci & Engn, Zhenjiang 212003, Peoples R China
[2] Jiangsu Univ Sci & Technol, Marine Equipment & Technol Inst, Zhenjiang 212003, Peoples R China
基金
中国国家自然科学基金;
关键词
CMT wire and arc additive manufacturing; 2205 duplex stainless steel; different scan paths; temperature field; stress field; COLD METAL TRANSFER; RESIDUAL-STRESS; MICROSTRUCTURE; PREDICTION; DISTORTION; PROPAGATION; PARAMETERS; MODEL;
D O I
10.3390/coatings12121971
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, the mechanical properties, microhardness and metallographic structure of 2205 duplex stainless steel by cold metal transfer (CMT) wire and arc additive manufacturing process are studied. The results show that the ultimate tensile strength, yield strength and elongation at break of reciprocating additive along building direction (BD) are 856.73 MPa, 710.5 MPa and 42.35%, respectively. In addition, the same direction motion (SDM) and reciprocating motion (RM) is selected as parameter variables in the experiment, and the finite element model is established by ABAQUS software, and the temperature and residual stress field of the additive forming at different paths are tested and simulated. Firstly, the accuracy of the selected finite element model was verified by comparing the experimental results from the simulation results to the macroscopic morphology of the cross-section of the single-pass additive specimen. The numerical simulation results show that due to the difference of the additive scanning paths, the distribution of the temperature field has a large difference, and with the increase of the deposited layer, the heat accumulation of the SDM additive is larger than that of the RM, so that the end collapses of the SDM additive will occur in the actual additive specimen. By simulating and comparing the equivalent stress distribution of different paths, the equivalent stress distribution of SDM and RM is approximately the same in the vertical direction, and the minimum of equivalent stress appears at the bottom of the deposition layers, about 116.5 MPa, and the maximum of equivalent stress appears at 8 mm from the top, about 348 MPa.
引用
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页数:16
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