Reliability analysis of embedded chip technique with design of experiment methods

被引：0
|
作者：
Lu, Xiuzhen [1 ]
Che, Liu [1 ]
Cheng, Zhaonian [1 ]
Liu, Johan [1 ]
机构：
[1] Shanghai Univ, Chinese Minist Educ, Key State Lab New Displays & Syst Integrat, Shanghai 200072, Peoples R China
来源：
EMAP 2005: INTERNATIONAL SYMPOSIUM ON ELECTRONICS MATERIALS AND PACKAGING | 2005年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents reliability and failure analysis of embedded components on the Liquid Crystalline Substrate. First, a demonstration module for embedded technology is fabricated. Then it is put into thermal cycling to find out the most obvious failure. 3D FEM analysis is employed to investigate the failure mode. A design of experiment method is conducted to obtain the optimal structure of embedded chip components.
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页码：43 / 49
页数：7
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