The Effect of Strain Rate and Strain Range on Bending Fatigue Test

被引:0
|
作者
Lou, Minyi [1 ]
Wen, Long [1 ]
Chen, Zhengrong [1 ]
Zhou, Jianwei [1 ]
Wang, Qian [1 ]
Lee, Jaisung [1 ]
机构
[1] Samsung Semicond China R&D Co Ltd, Suzhou 215021, Peoples R China
关键词
Strain-controlled bending fatigue test; strain rate; strain range; lifetime; failure mode;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
There're many kinds of bending test conditions according to different control modes: displacement control, force control and strain control. In our paper, strain-controlled bending test was chosen, since the lifetime and failure modes were more sensitive relating to different loading strain range and strain rate. ANSYS was used to simulate the bending test to predict board level solder joint reliability. The relationship between loading strain range and lifetime for 60BOC was measured in a similar type to Coffin-Manson equation. 5 failure modes were investigated, component side bulk crack, component side IMC interface crack, board side bulk crack, board side IMC interface crack and pad lift. The simulation results indicated that with the increase of strain range, the fatigue performance of device decreased.
引用
收藏
页码:944 / 948
页数:5
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