A NOVEL CONCEPT FOR AIR REMOVAL IN TWO-PHASE IMMERSION COOLING SYSTEMS

被引:0
|
作者
Peterson, Eric [1 ]
Morris, Seth [2 ]
Alissa, Husam [1 ]
Keehn, Nicholas [1 ]
Ramakrishnan, Bharath [1 ]
Oruganti, Vaidehi [1 ]
Manousakis, Ioannis [1 ]
Mckay, Noah [2 ]
机构
[1] Microsoft Corp, Redmond, WA 98052 USA
[2] D2H Adv Technol, Winston Salem, NC USA
关键词
Two-phase; immersion cooling; air removal; species separator; noncondensibles; stratification layer; segregated two-phase immersion cooling;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A 10 kW scale model of a decoupled immersion cooling rig is constructed in order to serve as a testbed for immersion cooling, using 3M FC3284 dielectric cooling fluid A species separator is constructed and demonstrates an ability to remove air from the flowfield before the condensable gases enter the condenser vessel, verified with Schlieren photography. The condenser underperformed significantly compared to initial sizing calculations using the NTU method, and film thickness of FC3284 liquid on the surface of the condenser was determined to be the cause due to low thermal conductivity of the liquid. The average film thickness on the surface of the condenser is calculated. In addition to the performance detriment of the film, air is also shown to reduce the condenser's performance. The height of a transient stratification line is measured and compared against condenser power. Condenser efficacy losses are large and variable based on the concentration of air in the condenser vessel. A low vs high-mounted boiler is investigated. The mounting of the boiler has an effect on how much vapor is lost during a maintenance event. Finally, a comparison of the test rig's overall cooling efficiency is made with various air-cooled datacenters by tracking energy consumption to cool a given IT load. This also translates to a reduction in carbon emissions.
引用
下载
收藏
页数:12
相关论文
共 50 条
  • [1] CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling
    Ramakrishnan, Bharath
    Alissa, Husam
    Manousakis, Ioannis
    Lankston, Robert
    Bianchini, Ricardo
    Kim, Washington
    Baca, Rich
    Misra, Pulkit A.
    Goiri, Inigo
    Jalili, Majid
    Raniwala, Ashish
    Warrier, Brijesh
    Monroe, Mark
    Belady, Christian
    Shaw, Mark
    Fontoura, Marcus
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (10): : 1703 - 1715
  • [2] POWER DENSITY IN THE CONTEXT OF TWO-PHASE IMMERSION COOLING
    Shah, Jimil M.
    Tuma, Phillip E.
    PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022, 2022,
  • [3] Enhanced Thermal Performance of High Flux LED Systems with Two-Phase Immersion Cooling
    Cengiz, Ceren
    Muslu, Ahmet Mete
    Arik, Mehmet
    Dogruoz, Baris
    PROCEEDINGS OF THE NINETEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2020), 2020, : 196 - 206
  • [4] Two-Phase Cooling in Cutting Systems
    Dubrov D.Y.
    Russian Engineering Research, 2022, 42 (03) : 262 - 266
  • [5] Advanced Thermal Integration for HPC Packages with Two-Phase Immersion Cooling
    Lin, Po-Yao
    Kuo, Sheng-Liang
    Yan, Kathy
    Chen, Wen-Ming
    Liao, Marvin De-Dui
    IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 566 - 573
  • [6] Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
    Shah, Jimil M.
    Crandall, Thomas
    Tuma, Phillip E.
    JOURNAL OF ELECTRONIC PACKAGING, 2023, 145 (04)
  • [7] Feasibility Study of Two-Phase Immersion Cooling in Closed Electronic Device
    Wada, Mizuki
    Matsunaga, Arihiro
    Hachiya, Mahiro
    Chiba, Masaki
    Ishihara, Kunihiko
    Yoshikawa, Minoru
    PROCEEDINGS OF THE 2017 SIXTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS ITHERM 2017, 2017, : 899 - 904
  • [8] Thermal Performance of Single-Phase and Two-Phase Immersion Cooling in Data Center
    Liu, Chun-Kai
    Chang, Tan-Yi
    2022 17TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2022,
  • [9] Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems of Servers
    Marcinichen, Jackson Braz
    Thome, John Richard
    2012 28TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM (SEMI-THERM), 2012, : 29 - 35
  • [10] Recent Advances in Two-Phase Immersion Cooling with Surface Modifications for Thermal Management
    Kang, Daehoon
    Lee, Jooyoung
    Chakraborty, Anirban
    Lee, Sang-Eui
    Kim, Gildong
    Yu, Choongho
    ENERGIES, 2022, 15 (03)