Thermal analysis of insulated metal substrates for automotive electronic assemblies

被引：12
|
作者：
Di Pascoli, S
Bagnoli, PE
Casarosa, C
机构：
[1] Dipartimento Ingn Informaz, I-56126 Pisa, Italy
[2] Dipartimento Energet, I-56126 Pisa, Italy
来源：
MICROELECTRONICS JOURNAL | 1999年 / 30卷 / 11期
关键词：
thermal analysis; insulated metal substrate; automotive assemblies;
D O I：
10.1016/S0026-2692(99)00075-0
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Two types of insulated metal substrates for surface mounting technology (SMT) for automotive applications were thermally examined by means of the TRAIT method [P.E. Bagnoli, C. Casarosa, M. Ciampi, E. Dallago, Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. Part I: fundamentals and theory, IEEE Transactions on Power Electronics 13 (1998) 1208-1219]. The results showed a noticeably lower static thermal resistance than other solutions commonly used. Moreover, TRAIT analysis provided evidence that the residue thermal resistance has to be ascribed to the epoxy insulating layer of the IMS substrates, suggesting that the differences between different types of IMS substrates are due to differences in the dielectric deposition technology. (C) 1999 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：1129 / 1135
页数：7
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