Non-isocyanate polyurethane adhesive from sucrose used for particleboard

Sucrose-based non-isocyanate polyurethanes (S-NIPU) were synthesized by the already codified reaction of sucrose, dimethyl carbonate and hexamethylene diamine and used for the first time as adhesives for bonding particleboard. To decrease the NIPU adhesive curing temperature, a silane coupling agent was used as a crosslinking promoter. The performance of particleboards prepared at a press temperature of 230 degrees C, 200 degrees C and 180 degrees C and a press time of 8 min, 10 min and 12 min was tested and evaluated. The structure of the oligomers obtained was detected by matrix-assisted laser desorption ionization time-of-flight mass spectrometry. Thermomechanical analysis and differential scanning calorimetry were also used to analyze their behavior. The particleboards bonded with the S-NIPU adhesive at 230 degrees C showed excellent properties, which, however, decreased as the press time was reduced. The silane coupling agent used as a crosslinking promoter significantly reduced the curing temperature of the adhesive and allowed to obtain good bonding at a lower press temperature. The results obtained confirmed that coupling the S-NIPU adhesive with a silane used as a crosslinking promoter can yield sufficiently improved results to function as a suitable adhesive for particleboard, medium density fiberboard and other types of particulate wood panels. It was also the first time that a NIPU adhesive was used for wood bonding.