Broadband THz Interconnect for Hybrid Integration of InP and Si Platforms

被引:0
|
作者
Iwamatsu, Shuya [1 ]
Ali, Muhsin [2 ]
Fernandez-Estevez, Jose Luis [1 ]
Makhlouf, Sumer [1 ]
Carpintero, Guillermo [2 ]
Stoehr, Andreas [1 ]
机构
[1] Univ Duisburg Essen, ZHO, Lotharstr 55, D-47057 Duisburg, Germany
[2] Univ Carlos III Madrid, Ave Univ 30, Madrid 28911, Spain
关键词
D O I
10.1109/IRMMW-THz50927.2022.9895647
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrate a broadband terahertz coupling between InP-based coplanar waveguide and silicon dielectric rod waveguide for hybrid integration. A coupling efficiency of around -2 dB has been experimentally achieved in frequency range between 70-120 GHz. Numerical simulations reveal an operational 3dB-bandwidth >100 GHz.
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页数:2
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